Semiconductor device

ABSTRACT

A semiconductor device includes a first transistor which includes a first gate electrode below its oxide semiconductor layer and a second gate electrode above its oxide semiconductor layer, and a second transistor which includes a first gate electrode above its oxide semiconductor layer and a second gate electrode below its oxide semiconductor layer and is provided so as to at least partly overlap with the first transistor. In the semiconductor device, a conductive film serving as the second gate electrode of the first transistor and the second gate electrode of the second transistor is shared between the first transistor and the second transistor. Note that the second gate electrode not only controls the threshold voltages (Vth) of the first transistor and the second transistor but also has an effect of reducing interference of an electric field applied from respective first gate electrodes of the first transistor and the second transistor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method formanufacturing the semiconductor device.

Note that in this specification, a semiconductor device refers to anydevice that can function by utilizing semiconductor characteristics, andan electro-optical device, a semiconductor circuit, an electronicdevice, and the like are all semiconductor devices.

2. Description of the Related Art

A technique for forming a transistor by using a semiconductor filmformed over a substrate having an insulating surface has attractedattention. The transistor is applied to a wide range of semiconductordevices such as an integrated circuit (IC) and an image display device(display device). A silicon-based semiconductor film is known as asemiconductor film applicable to the transistor. In recent years, anoxide semiconductor film has attracted attention.

For example, a transistor using an amorphous oxide semiconductor filmwhich contains indium, gallium, and zinc and has an electron carrierconcentration of lower than 10¹⁸/cm³ is disclosed (see Patent Document1).

Since the oxide semiconductor film has a high electron mobility, theoperation speed of a transistor using the oxide semiconductor film issignificantly higher than that of a transistor using an amorphoussilicon film. Further, the transistor using the oxide semiconductor filmhas an advantage of suppression of equipment investment, becauseproduction equipment for the transistor using the amorphous silicon filmcan be applied thereto with partly improvement.

Further, a memory to which characteristics of a transistor using anoxide semiconductor film is applied has been proposed (see PatentDocument 2). Note that an oxide semiconductor film can be formed by atechnique for forming a thin film such as a sputtering method. Further,a transistor using an oxide semiconductor film can be manufacturedthrough a process performed at a low temperature lower than or equal toabout 350° C. Therefore, there are few limitations on manufacturing atransistor using an oxide semiconductor film so as to overlap with atransistor, which allows reduction in the cell area.

In a transistor using an oxide semiconductor film, carriers may begenerated due to an impurity such as hydrogen and oxygen vacancy, andthe threshold voltage (Vth) of the transistor may be shifted in anegative direction. Therefore, controlling the threshold voltage (Vth)of the transistor using an oxide semiconductor film by employing astructure of a transistor including gate electrodes above and below itsoxide semiconductor film, in which a back gate electrode which forms apair with a front gate electrode is provided, has been considered (seePatent Document 3).

REFERENCE Patent Document [Patent Document 1] Japanese Published PatentApplication No. 2006-165528 [Patent Document 2] Japanese PublishedPatent Application No. 2011-151383 [Patent Document 3] JapanesePublished Patent Application No. 2010-283338 SUMMARY OF THE INVENTION

To manufacture a transistor including gate electrodes above and belowits oxide semiconductor layer, a front gate electrode (also referred toas a first gate electrode) and a back gate electrode (also referred toas a second gate electrode) are formed, and accordingly the number ofsteps is increased.

Further, the area per one transistor can be reduced in a semiconductordevice by stacking a plurality of transistors each using an oxidesemiconductor film; however, in the case where a transistor includinggate electrodes above and below its oxide semiconductor layer isprovided so as to at least partly overlap with a transistor includinggate electrodes above and below its oxide semiconductor layer, a secondgate electrode is provided per transistor.

In view of the foregoing, an object of one embodiment of the presentinvention is to improve the yield of a semiconductor device in which atransistor including gate electrodes above and below its oxidesemiconductor layer overlaps with a transistor including gate electrodesabove and below its oxide semiconductor layer. Further, an object of oneembodiment of the present invention is to suppress an increase in thenumber of manufacturing steps of the semiconductor device.

One embodiment of the present invention is a semiconductor deviceincluding a first transistor including gate electrodes above and belowits oxide semiconductor layer and a second transistor which includesgate electrodes above and below its oxide semiconductor layer and isprovided so as to at least partly overlap with the first transistor. Aconductive film serving as a second gate electrode is shared between thefirst transistor and the second transistor.

Note that the second gate electrode not only controls the thresholdvoltages (Vth) of the first transistor and the second transistor butalso has an effect of reducing interference of an electric field appliedfrom respective first gate electrodes of the first transistor and thesecond transistor.

Another embodiment of the present invention is a semiconductor devicewhich includes an insulating film having a planar upper surface providedover a second transistor; a third transistor which has the samestructure as a first transistor and is provided over the insulatingfilm; and a fourth transistor which has the same structure as the secondtransistor and is provided so as to at least partly overlap with thethird transistor. A conductive film serving as a second gate electrodeis shared between the third transistor and the fourth transistor.

As described above, the first transistor and the second transistor canbe configured to be one structure, and the plurality of structures canbe provided so as to be stacked. Specifically, the number of thestructures which are stacked may be 2 or more and 10 or less, preferably3 or more and 20 or less, more preferably 5 or more and 50 or less.Needless to say, the number of the structures which are stacked may beset beyond 50.

In the case where the plurality of structures each described above arestacked, the conductive film serving as the second gate electrode isprovided per 2 transistors. Accordingly, the number of steps for formingsecond gate electrodes can be reduced. In other words, one conductivefilm serving as a second gate electrode can be omitted per structure.Thus, in the case where the plurality of structures are provided so asto be stacked, breaking caused by stress during manufacture of thesemiconductor device can be suppressed, so that a semiconductor deviceincluding more transistors can be manufactured. In other words, thesemiconductor device can be highly integrated and the yield can beimproved. Further, even when the plurality of structures are stacked asdescribed above, interference of an electric field can be reduced by theeffect of the second gate electrode.

Note that the semiconductor device of one embodiment of the presentinvention is suitable for a memory. This is because the cell area can bereduced by overlapping a plurality of memory cells.

Another embodiment of the present invention is a semiconductor deviceincluding a first transistor provided over an insulating surface and asecond transistor provided so as to at least partly overlap with thefirst transistor. The first transistor includes a first conductive film;a first insulating film provided over the first conductive film; a firstoxide semiconductor film provided over the first insulating film; asecond conductive film and a third conductive film which are provided soas to be at least partly in contact with the first oxide semiconductorfilm; a second insulating film provided over the second conductive film,the third conductive film, and the first oxide semiconductor film; and afourth conductive film provided over the second insulating film. Thesecond transistor includes the fourth conductive film; a thirdinsulating film provided over the fourth conductive film; a second oxidesemiconductor film provided over the third insulating film; a fifthconductive film and a sixth conductive film which are provided so as tobe at least partly in contact with the second oxide semiconductor film;a fourth insulating film provided over the fifth conductive film, thesixth conductive film, and the second oxide semiconductor film; and aseventh conductive film provided over the fourth insulating film. Thefirst oxide semiconductor film at least partly overlaps with the firstconductive film and the fourth conductive film. The second oxidesemiconductor film at least partly overlaps with the fourth conductivefilm and the seventh conductive film. Note that a fifth insulating filmhaving a planar upper surface is preferably provided over the seventhconductive film and the fourth insulating film of the second transistor.

Further, an embodiment of the present invention is a semiconductordevice which has a second structure similar to a first structureincluding the first transistor and the second transistor over the firststructure.

In the embodiment, the first conductive film at least partly serves asthe first gate electrode of the first transistor. The seventh conductivefilm at least partly serves as the first gate electrode of the secondtransistor. The fourth conductive film at least partly serves as thesecond gate electrode of the first transistor. The fourth conductivefilm at least partly serves as the second gate electrode of the secondtransistor.

Another embodiment of the present invention is a semiconductor deviceincluding a first conductive film provided over an insulating surface; afirst insulating film provided over the first conductive film; a firstoxide semiconductor film which is provided over the first insulatingfilm and at least partly overlaps with the first conductive film; asecond conductive film and a third conductive film which are providedover the first oxide semiconductor film; a second insulating filmprovided over the second conductive film, the third conductive film, andthe first oxide semiconductor film; a fourth conductive film which isprovided over the second insulating film and at least partly overlapswith the second conductive film; a fifth conductive film which isprovided over the second insulating film and at least partly overlapswith the first oxide semiconductor film; a third insulating filmprovided over the second insulating film, the fourth conductive film,and the fifth conductive film; a second oxide semiconductor film whichis provided over the third insulating film and at least partly overlapswith the fifth conductive film; a sixth conductive film and a seventhconductive film which are provided over the second oxide semiconductorfilm; a fourth insulating film provided over the sixth conductive film,the seventh conductive film, and the second oxide semiconductor film; aneighth conductive film which is provided over the fourth insulating filmand at least partly overlaps with the sixth conductive film; a ninthconductive film which is provided over the fourth insulating film and atleast partly overlaps with the second oxide semiconductor film; a fifthinsulating film provided over the fourth insulating film, the eighthconductive film, and the ninth conductive film; and a tenth conductivefilm provided over the fifth insulating film. Note that an openingreaching the third conductive film is formed in the second insulatingfilm, the third insulating film, the second oxide semiconductor film,the seventh conductive film, the fourth insulating film, and the fifthinsulating film. The tenth conductive film is in contact with the thirdconductive film through the opening. Note that a sixth insulating filmhaving a planar upper surface is preferably provided over the tenthconductive film.

Another embodiment of the present invention is a semiconductor deviceincluding a first conductive film provided over an insulating surface; afirst insulating film provided over the first conductive film; a firstoxide semiconductor film which is provided over the first insulatingfilm and at least partly overlaps with the first conductive film; asecond conductive film and a third conductive film which are providedover the first oxide semiconductor film; a second insulating filmprovided over the second conductive film, the third conductive film, andthe first oxide semiconductor film; a fourth conductive film which isprovided over the second insulating film and at least partly overlapswith the second conductive film; a fifth conductive film which isprovided over the second insulating film and at least partly overlapswith the first oxide semiconductor film; a third insulating filmprovided over the second insulating film, the fourth conductive film,and the fifth conductive film; a sixth conductive film which is providedover the third insulating film and at least partly overlaps with thefourth conductive film; a seventh conductive film provided over thethird insulating film; a second oxide semiconductor film which isprovided over the third insulating film, the sixth conductive film, andthe seventh conductive film and at least partly overlaps with the fifthconductive film; a fourth insulating film provided over the sixthconductive film, the seventh conductive film, and the second oxidesemiconductor film; an eighth conductive film which is provided over thefourth insulating film and at least partly overlaps with the secondoxide semiconductor film; a fifth insulating film provided over theeighth conductive film; and a ninth conductive film provided over thefifth insulating film. Note that an opening reaching the thirdconductive film is formed in the second insulating film, the thirdinsulating film, the second oxide semiconductor film, the seventhconductive film, the fourth insulating film, and the fifth insulatingfilm. The ninth conductive film is in contact with the third conductivefilm through the opening. Note that a sixth insulating film having aplanar upper surface is preferably provided over the ninth conductivefilm.

A conductive film serving as a second gate electrode is shared betweentwo transistors each including gate electrodes above and below its oxidesemiconductor layer, whereby the semiconductor device can be highlyintegrated and the yield can be improved. Further, it is possible tosuppress an increase in the number of manufacturing steps of thesemiconductor device

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A and 1B are a top view and a cross-sectional view, respectively,illustrating an example of a semiconductor device of one embodiment ofthe present invention;

FIGS. 2A to 2D are cross-sectional views illustrating a method formanufacturing a semiconductor device of one embodiment of the presentinvention;

FIGS. 3A to 3C are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 4A to 4C are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 5A and 5B are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 6A and 6B are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 7A and 7B are a top view and a cross-sectional view, respectively,illustrating an example of a semiconductor device of one embodiment ofthe present invention;

FIG. 8 is a circuit diagram which corresponds to a semiconductor deviceof one embodiment of the present invention.

FIGS. 9A to 9D are cross-sectional views illustrating a method formanufacturing a semiconductor device of one embodiment of the presentinvention;

FIGS. 10A to 10C are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 11A to 11C are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 12A and 12B are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 13A and 13B are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 14A and 14B are cross-sectional views illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIG. 15 is a cross-sectional view illustrating a method formanufacturing the semiconductor device of one embodiment of the presentinvention;

FIGS. 16A and 16B are a top view and a cross-sectional view,respectively, illustrating an example of a semiconductor device of oneembodiment of the present invention;

FIGS. 17A and 17B are cross-sectional views illustrating an example of asemiconductor device of one embodiment of the present invention;

FIGS. 18A to 18C are perspective views each illustrating an electronicdevice of one embodiment of the present invention; and

FIGS. 19A and 19B are a top view and a cross-sectional view,respectively, illustrating a structure of a transistor.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. However, the presentinvention is not limited to the description below, and it is easilyunderstood by those skilled in the art that modes and details disclosedherein can be modified in various ways without departing from the spiritand the scope of the present invention. Therefore, the present inventionis not construed as being limited to description of the embodiments. Indescribing structures of the present invention with reference to thedrawings, the same reference numerals are used in common for the sameportions in different drawings. Note that the same hatch pattern isapplied to similar parts, and the similar parts are not especiallydenoted by reference numerals in some cases.

In this specification, when one of a source and a drain of a transistoris called a drain, the other is called a source. That is, they are notdistinguished depending on the potential level. Therefore, a portioncalled a source in this specification can be alternatively referred toas a drain.

Note that voltage refers to a potential difference between apredetermined potential and a reference potential (e.g., a groundpotential or a source potential) in many cases. Accordingly, a voltagecan also be called a potential. Even when a potential is represented as,for example, a potential VH, a potential VDD, or a potential GND, thepotential is not exactly equal to the potential VH, the potential VDD,or the potential GND in some cases. Therefore, the potential VH, thepotential VDD, and the potential GND can be referred to as a potentialclose to the potential VH, a potential close to the potential VDD, and apotential close to the potential GND, respectively. Note that “to begrounded” has the same meaning as “to be connected to GND”.

Further, even when the expression “to be connected” is used in thisspecification, there is a case in which no physical connection is madein an actual circuit and a wiring is just extended.

Note that the ordinal numbers such as “first” and “second” in thisspecification are used for convenience and do not denote the order ofsteps or the stacking order of layers. In addition, the ordinal numbersin this specification do not denote particular names which specify thepresent invention.

Embodiment 1

In this embodiment, a semiconductor device of one embodiment of thepresent invention will be described with reference to FIGS. 1A and 1B,FIGS. 2A to 2D, FIGS. 3A to 3C, FIGS. 4A to 4C, FIGS. 5A and 5B, andFIGS. 6A and 6B.

FIG. 1A is a top view illustrating a semiconductor device of oneembodiment of the present invention. FIG. 1B is a cross-sectional viewtaken along dashed-dotted line A-B in FIG. 1A. In FIG. 1A, a film whichis not seen due to overlap, an insulating film, and the like, areomitted for simplicity.

A semiconductor device illustrated in FIG. 1B includes a firstconductive film 104 a provided over a first insulating film 102 which isprovided over a substrate 101; a second insulating film 112 a providedover the first conductive film 104 a and the first insulating film 102;a first oxide semiconductor film 106 a which is provided over the secondinsulating film 112 a and at least partly overlaps with the firstconductive film 104 a; a second conductive film 116 a provided over thefirst oxide semiconductor film 106 a; a third conductive film 126 aprovided over the first oxide semiconductor film 106 a; a thirdinsulating film 110 a provided over the second conductive film 116 a,the third conductive film 126 a, and the first oxide semiconductor film106 a; a fourth conductive film 114 which is provided over the thirdinsulating film 110 a and at least partly overlaps with the first oxidesemiconductor film 106 a and the first conductive film 104 a; a fourthinsulating film 120 a which is provided over the third insulating film110 a and whose upper surface is level with that of the fourthconductive film 114; a fifth insulating film 110 b provided over thefourth conductive film 114 and the fourth insulating film 120 a; asecond oxide semiconductor film 106 b which is provided over the fifthinsulating film 110 b and at least partly overlaps with the fourthconductive film 114; a fifth conductive film 116 b which is providedover the second oxide semiconductor film 106 b and which at least partlyoverlap with the second conductive film 116 a; a sixth conductive film126 b which is provided over the second oxide semiconductor film 106 band which at least partly overlap with the third conductive film 126 a;a sixth insulating film 112 b provided over the fifth conductive film116 b, the sixth conductive film 126 b, and the second oxidesemiconductor film 106 b; and a seventh conductive film 104 b which isprovided over the sixth insulating film 112 b and at least partlyoverlaps with the second oxide semiconductor film 106 b and the fourthconductive film 114. Note that a seventh insulating film 120 b having aplanar upper surface is preferably provided over the seventh conductivefilm 104 b and the sixth insulating film 112 b.

Note that in FIG. 1B, the first conductive film 104 a, the fourthconductive film 114, and the seventh conductive film 104 b do notoverlap with any of the second conductive film 116 a, the thirdconductive film 126 a, the fifth conductive film 116 b, and the sixthconductive film 126 b; however, embodiments of the present invention arenot limited thereto. For example, the first conductive film 104 a, thefourth conductive film 114, and the seventh conductive film 104 b may atleast partly overlap with the second conductive film 116 a, the thirdconductive film 126 a, the fifth conductive film 116 b, and the sixthconductive film 126 b.

There is no particular limitation on the substrate 101 as long as it hasheat resistance enough to withstand at least heat treatment performedlater. For example, a glass substrate, a ceramic substrate, a quartzsubstrate, or a sapphire substrate may be used as the substrate 101.Alternatively, a single crystal semiconductor substrate or apolycrystalline semiconductor substrate made of silicon, siliconcarbide, or the like, a compound semiconductor substrate made of silicongermanium or the like, a silicon-on-insulator (SOI) substrate, or thelike may be used as the substrate 101. Still alternatively, any of thesesubstrates further provided with a semiconductor element may be used asthe substrate 101.

In the case of using a large glass substrate such as the fifthgeneration (1000 mm×1200 mm or 1300 mm×1500 mm); the sixth generation(1500 mm×1800 mm); the seventh generation (1870 mm×2200 mm); the eighthgeneration (2200 mm×2500 mm); the ninth generation (2400 mm×2800 mm); orthe tenth generation (2880 mm×3130 mm) as the substrate 101, in somecases, microfabrication is difficult due to the shrinkage of thesubstrate 101, which is caused by heat treatment or the like in amanufacturing process of the semiconductor device. Accordingly, in thecase of using a large glass substrate described above as the substrate101, a substrate with small shrinkage is preferably used. For example, alarge glass substrate whose shrinkage by heat treatment for one hour at400° C., preferably 450° C., more preferably 500° C. is less than orequal to 10 ppm, preferably less than or equal to 5 ppm, more preferablyless than or equal to 3 ppm, may be used as the substrate 101.

Further, a flexible substrate may be used as the substrate 101. Notethat as a method for forming a transistor over a flexible substrate,there is also a method in which, after a transistor is formed over anon-flexible substrate, the transistor is separated and transferred tothe substrate 101 which is a flexible substrate. In that case, aseparation layer is preferably provided between the non-flexiblesubstrate and the transistor.

The first insulating film 102 is provided in order that an impurityattributed to the substrate 101 does not adversely affect the firstoxide semiconductor film 106 a. In contrast, in the case where thesubstrate 101 does not contain an impurity, the first insulating film102 is not necessarily provided.

The first insulating film 102 may be formed of a single layer or astacked layer of an insulating film(s) containing any of aluminum oxide,aluminum nitride, magnesium oxide, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, germanium oxide, yttrium oxide,zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, andtantalum oxide.

In this specification, silicon oxynitride refers to a substance thatcontains more oxygen than nitrogen. For example, silicon oxynitrideincludes oxygen, nitrogen, silicon, and hydrogen at concentrationsranging from greater than or equal to 50 atomic % and less than or equalto 70 atomic %, greater than or equal to 0.5 atomic % and less than orequal to 15 atomic %, greater than or equal to 25 atomic % and less thanor equal to 35 atomic %, and greater than or equal to 0 atomic % andless than or equal to 10 atomic %, respectively. In addition, siliconnitride oxide refers to a substance that contains a larger amount ofnitrogen than that of oxygen. For example, silicon nitride oxidecontains oxygen, nitrogen, silicon, and hydrogen at concentrationsranging from greater than or equal to 5 atomic % and less than or equalto 30 atomic %, greater than or equal to 20 atomic % and less than orequal to 55 atomic %, greater than or equal to 25 atomic % and less thanor equal to 35 atomic %, and greater than or equal to 10 atomic % andless than or equal to 25 atomic %, respectively. Note that the aboveranges are ranges for cases where measurement is performed usingRutherford backscattering spectrometry (RBS) and hydrogen forwardscattering spectrometry (HFS). Moreover, the total of the percentages ofthe constituent elements does not exceed 100 atomic %.

The first conductive film 104 a at least partly serves as a first gateelectrode in a transistor using the first oxide semiconductor film 106a. For example, the first conductive film 104 a may be formed of asingle layer or a stacked layer of a simple substance selected from Al,Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ag, Ta, and W; a nitride containing oneor more kinds of the above substances; an oxide containing one or morekinds of the above substances; or an alloy containing one or more kindsof the above substances. Alternatively, an oxide or an oxynitride whichcontains at least In and Zn may be used. For example, an In—Ga—Zn—O—Ncompound may be used.

The second insulating film 112 a at least partly serves as a gateinsulating film. For example, the second insulating film 112 a may beformed of a single layer or a stacked layer of an insulating film(s)containing any of aluminum oxide, magnesium oxide, silicon oxide,silicon oxynitride, germanium oxide, yttrium oxide, zirconium oxide,lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide.

The first oxide semiconductor film 106 a includes a channel region in aregion which overlaps with the first conductive film 104 a. Note thatthe channel region is a region in which a channel is formed by theelectric field of a gate electrode. When the channel is formed, currentflows by application of voltage between a source and a drain.

The first oxide semiconductor film 106 a may be formed using anIn—M—Zn—O compound, for example. Here, a metal element M is an elementwhose bond energy with oxygen is higher than that of In and that of Zn.Alternatively, the metal element M is an element which has a function ofsuppressing desorption of oxygen from the In—M—Zn—O compound. Owing tothe effect of the metal element M, generation of oxygen vacancies in theoxide semiconductor film is suppressed. Therefore, change incharacteristics of the transistor, which is caused by oxygen vacancies,can be reduced; accordingly, a highly reliable transistor can beobtained.

The metal element M may be, specifically, Al, Sc, Ti, V, Cr, Mn, Fe, Co,Ni, Ga, Y, Zr, Nb, Mo, Sn, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er,Tm, Yb, Lu, Hf, Ta, or W, and is preferably Al, Ti, Ga, Y, Zr, Ce, orHf. As the metal element M, one or two or more kinds of the aboveelements may be selected. Further, Si or Ge may be used instead of themetal element M.

The first oxide semiconductor film 106 a is in a single crystal state, apolycrystalline (also referred to as polycrystal) state, an amorphousstate, or the like.

The first oxide semiconductor film 106 a is preferably a CAAC-OS (c-axisaligned crystalline oxide semiconductor) film.

The CAAC-OS film is not completely single crystal nor completelyamorphous. The CAAC-OS film is an oxide semiconductor film having acrystal-amorphous mixed structure in which an amorphous phase includes acrystal portion and an amorphous portion. Note that in most cases, thecrystal portion fits inside a cube whose one side is less than 100 nmFrom an observation image obtained with a transmission electronmicroscope (TEM), a boundary between an amorphous portion and a crystalportion in the CAAC-OS film is not clear. Further, with the TEM, a grainboundary in the CAAC-OS film is not found. Thus, in the CAAC-OS film, areduction in carrier mobility, due to the grain boundary, is suppressed.

In each of the crystal portions included in the CAAC-OS film, a c-axisis aligned in a direction perpendicular to a surface where the CAAC-OSfilm is formed or a surface of the CAAC-OS film, triangular or hexagonalatomic arrangement which is seen from the direction perpendicular to thea-b plane is formed, and metal atoms are arranged in a layered manner ormetal atoms and oxygen atoms are arranged in a layered manner when seenfrom the direction perpendicular to the c-axis. Note that, among crystalportions, the directions of the a-axis and the b-axis of one crystalportion may be different from those of another crystal portion. In thisspecification, a simple term “perpendicular” includes a range from 85°to 95°.

In the CAAC-OS film, distribution of crystal portions is not necessarilyuniform. For example, in the formation process of the CAAC-OS film, inthe case where crystal growth starts from a surface side of the firstoxide semiconductor film 106 a, the proportion of crystal portions inthe vicinity of the surface of the first oxide semiconductor film 106 ais higher than that in the vicinity of the surface where the first oxidesemiconductor film 106 a is formed in some cases. Further, when animpurity is added to the CAAC-OS film, the crystal portion in a regionto which the impurity is added becomes amorphous in some cases.

Since the c-axes of the crystal portions included in the CAAC-OS filmare aligned in the direction parallel to a normal vector of a surfacewhere the CAAC-OS film is formed or a normal vector of a surface of theCAAC-OS film, the directions of the c-axes may be different from eachother depending on the shape of the CAAC-OS film (the cross-sectionalshape of the surface where the CAAC-OS film is formed or thecross-sectional shape of the surface of the CAAC-OS film). Note thatwhen the CAAC-OS film is formed, the direction of c-axis of the crystalportion is the direction parallel to a normal vector of the surfacewhere the CAAC-OS film is formed or a normal vector of the surface ofthe CAAC-OS film. The crystal portion is formed by film formation or byperforming treatment for crystallization such as heat treatment afterfilm formation.

Further, change in characteristics of a transistor using the CAAC-OSfilm, due to irradiation with visible light or ultraviolet light issmall. Thus, the transistor has high reliability.

Note that the oxide semiconductor film (here, each of the first oxidesemiconductor film 106 a and the second oxide semiconductor film 106 b)is preferably an oxide semiconductor film which is highly purified andhardly contains impurities such as copper, aluminum, and chlorine. In aprocess of forming the transistor, a process in which there is not apossibility that the impurities are mixed into the oxide semiconductorfilm or attached to surfaces of the oxide semiconductor film ispreferably selected as appropriate. In the case where the impurities areattached to the surfaces of the oxide semiconductor film, exposure tooxalic acid or dilute hydrofluoric acid, or plasma treatment (N₂O plasmatreatment or the like) is preferably performed to remove the impuritiesattached to the surfaces of the oxide semiconductor film. Specifically,the copper concentration in the oxide semiconductor film is 1×10¹⁸atoms/cm³ or less, preferably 1×10¹⁷ atoms/cm³ or less. The aluminumconcentration in the oxide semiconductor film is 1×10¹⁸ atoms/cm³ orless. The chlorine concentration in the oxide semiconductor film is2×10¹⁸ atoms/cm³ or less.

In addition, it is preferable that the oxide semiconductor layer containoxygen in a proportion higher than that in the stoichiometriccomposition to be supersaturated shortly after the oxide semiconductorlayer is deposited. For example, in the case of depositing the oxidesemiconductor film by a sputtering method, deposition is preferablyperformed under conditions where the proportion of oxygen contained in adeposition gas is high, in particular, in an oxygen atmosphere. Whendeposition is performed under conditions where the proportion of oxygencontained in a deposition gas is high, in particular, in an oxygenatmosphere, Zn is prevented from being released from the oxidesemiconductor film even when the deposition temperature is higher thanor equal to 300° C.

Here, the oxide semiconductor film is preferably highly purified bysufficient removal of impurities such as hydrogen therefrom. Further,the oxide semiconductor film is preferably supersaturated with oxygen bysufficient supply of oxygen. Specifically, the hydrogen concentration inthe oxide semiconductor film is 5×10²⁰ atoms/cm³ or less, preferably5×10¹⁹ atoms/cm³ or less, more preferably 5×10¹⁸ atoms/cm³ or less,still more preferably 5×10¹⁷ atoms/cm³ or less. Note that the hydrogenconcentration in the oxide semiconductor film is measured by secondaryion mass spectrometry (SIMS). Further, an insulating film (e.g. a SiOxfilm) containing excess oxygen is provided so as to be in contact withand thus cover the oxide semiconductor film so that the oxidesemiconductor film can be supersaturated with oxygen by sufficientsupply of oxygen.

Further, the hydrogen concentration in the insulating film containingexcess oxygen is also an important factor because it affects thecharacteristics of the transistor.

An influence of the hydrogen concentration in the insulating filmcontaining excess oxygen on the characteristics of the transistor willbe described below.

First, hydrogen was intentionally added into the insulating filmcontaining excess oxygen, and the hydrogen concentration was measured bySIMS.

A method for forming samples will be described below.

First, a glass substrate was prepared, and a silicon oxide film wasformed over the glass substrate to a thickness of 300 nm by a sputteringmethod.

The silicon oxide film was formed under the following conditions: aquartz target was used; the pressure was 0.4 Pa; the power was 1.5 kW(13.56 MHz); and the substrate temperature in the film formation was100° C.

Four kinds of samples were prepared. Note that respective conditions forforming the samples were similar to one another except for the flow rateratio of the deposition gas for the silicon oxide film, oxygen gas (O₂),a deuterium gas (D₂), and an argon gas (Ar).

Table 1 shows names of the samples; the flow rate ratios of depositiongases used for deposition of silicon oxide films; the D (deuterium atom)concentrations at depths of 30 nm in the silicon oxide films; and the H(hydrogen atom) concentrations at depths of 30 nm in the silicon oxidefilms. Note that as for the proportions of D₂ (D₂/(O₂+Ar+D₂)) in thedeposition gases for the samples, the proportion of D₂ in Sample 1 was 0vol %, the proportion of D₂ in Sample 2 was 0.005 vol %, the proportionof D₂ in Sample 3 was 0.50 vol %, and the proportion of D₂ in Sample 4was 2.50 vol %.

TABLE 1 Concentration Concentration Name of O₂ Ar D₂ Proportion of D ofH Sample [sccm] [sccm] [sccm] of D₂ [atoms/cm³] [atoms/cm³] Sample 1 2525 0  0% 5.1E+15 6.4E+19 Sample 2 25 24.9975 0.0025 0.005%  1.6E+191.4E+20 Sample 3 25 24.75 0.25 0.5% 5.6E+20 7.2E+19 Sample 4 25 23.751.25 2.5% 7.2E+20 1.9E+19

Table 1 shows that the higher the proportion of D₂ in the depositiongases is, the higher the D concentration in the silicon oxide film is.

Next, transistors were formed using Samples 1 to 4 shown in Table 1.

FIG. 19A is a top view illustrating each of transistors which wereobjects to be measured. FIG. 19B is a cross-sectional view taken alongdashed-dotted line A-B in FIG. 19A. Note that for simplicity, aprotective insulating film 2118, a gate insulating film 2112, aninsulating film 2102, and the like are omitted in FIG. 19A.

The transistor illustrated in FIG. 19B includes a substrate 2100; theinsulating film 2102 which contains excess oxygen and is provided overthe substrate 2100; an oxide semiconductor film 2106 provided over theinsulating film 2102; a pair of electrodes 2116 provided over the oxidesemiconductor film 2106; the gate insulating film 2112 provided so as tocover the oxide semiconductor film 2106 and the pair of electrodes 2116;a gate electrode 2104 provided so as to overlap with the oxidesemiconductor film 2106 with the gate insulating film 2112 interposedtherebetween; and the protective insulating film 2118 provided over thegate electrode 2104 and the gate insulating film 2112.

As the insulating film 2102, any of Samples 1 to 4 shown in Table 1 wasused. The thickness of the insulating film 2102 was 300 nm.

As the substrate 2100, a glass substrate was used. As the oxidesemiconductor film 2106, a 20 nm-thick IGZO film (formed using a targetof In:Ga:Zn=1:1:1 [atomic ratio]) was used. As the pair of electrodes2116, a 100 nm-thick tungsten film was used. As the gate insulating film2112, a 30 nm-thick silicon oxynitride film was used. As the gateelectrode 2104, a film of a 15 nm-thick tantalum nitride film and a 135nm-thick tungsten film, which was stacked in this order from the gateinsulating film 2112 side, was used. As the protective insulating film2118, a 300 nm-thick silicon oxynitride film was used.

A BT stress test was performed on the transistors having theabove-described structure. Note that for the measurement, thetransistors each of which had a channel length (L) of 10 μm and achannel width (W) of 10 μm and in each of which the length (Lov) of aportion where the gate electrode 2104 overlaps with each of the pair ofelectrodes 2116 in the channel length direction was 1 μm (2 μm in total)were used. A method for the BT stress test will be described below.

First, the drain current (Id) was measured under conditions that thesubstrate temperature was 25° C., the drain voltage (V_(d)) of thetransistor was 3 V, and the gate voltage (V_(g)) of the transistor wasswept from −6 V to 6 V. The characteristics of the transistor measuredin this manner are called “characteristics of the transistor before theBT stress test”, which are represented by voltage relative to the sourcepotential.

Next, V_(d) was set to 0.1 V, V_(g) was set to −6 V, and the substratetemperature was set to 150° C., under which the transistors were keptfor one hour.

Next, the drain current (Id) was measured under conditions that thesubstrate temperature was 25° C., the drain voltage (V_(d)) of thetransistor was 3 V, and the gate voltage (V_(g)) of the transistor wasswept from −6 V to 6 V. The characteristics of the transistor measuredin this manner are called “characteristics of the transistor after theBT stress test”.

Table 2 shows threshold voltage (V_(th)) and field effect mobility(μ_(FE)) before and after the BT stress test. Note that names of Samplesshown in Table 2 corresponds to the names of Samples shown in Table 1;Table 1 can be referred to for the conditions of the insulating film2102.

TABLE 2 Before BT stress test After BT stress test Name of Vth μ_(FE)Vth μ_(FE) Samples [V] [cm²/Vs] [V] [cm²/Vs] Sample 1 0.94 8.6 1.17 7.8Sample 2 0.82 8.6 1.03 8.2 Sample 3 0.89 8.8 1.05 7.8 Sample 4 0.71 8.70.43 2.5

According to Table 2, it was found that in Sample 4, the field effectmobility (μ_(FE)) was drastically decreased as a result of the BT stresstest.

Further, characteristics of respective transistors having smaller L weremeasured. As a result, variation in threshold voltage (Vth) in anegative direction was larger in Sample 4 than in the other Samples.

As described above, it was found that abnormality of characteristics ofthe transistor is caused in the case where the D concentration in thesilicon oxide film was 7.2×10²⁰ atoms/cm³ in the transistor having astructure in which the silicon oxide film was in contact with the oxidesemiconductor film.

As described above, in the case where the hydrogen concentration in theinsulating film containing excess oxygen is greater than or equal to7.4×10²⁰ atoms/cm³ (greater than or equal to the total concentration ofthe D concentration of 7.2×10²⁰ atoms/cm³+the H concentration of1.9×10¹⁹ atoms/cm³), it is found that variation in characteristics ofthe transistor is increased and a channel length dependence of thetransistor is increased. Further, the characteristics of the transistorare significantly deteriorated by the BT stress test. Therefore, thehydrogen concentration in the insulating film containing excess oxygenis preferably less than 7.4×10²⁰ atoms/cm³. Specifically, the hydrogenconcentration in the oxide semiconductor film is preferably less than orequal to 5×10¹⁹ atoms/cm³, and the hydrogen concentration in theinsulating film containing excess oxygen is preferably less than7.4×10²⁰ atoms/cm³.

Further, a blocking layer (e.g. an AlOx film) which suppress release ofoxygen from the oxide semiconductor film is preferably provided outsidethe insulating film containing excess oxygen so as to cover the oxidesemiconductor film.

The insulating layer containing excessive oxygen or the blocking layeris provided to cover the oxide semiconductor layer, whereby the oxidesemiconductor layer can contain oxygen in a proportion which issubstantially the same as that in the stoichiometric composition, or ina proportion higher than that in the stoichiometric composition i.e.,the oxide semiconductor layer can be supersaturated with oxygen. Forexample, in the case where the oxide semiconductor film is an IGZO filmin which the stoichiometric composition is In:Ga:Zn:O=1:1:1:4 [atomicratio], the atomic ratio of oxygen contained in the IGZO film is largerthan 4.

The oxide semiconductor film which contains oxygen sufficiently and ishighly purified has a band gap of about 2.8 eV to 3.2 eV, has extremelyfew minority carriers having a density of about 1×10⁻⁹/cm³. Majoritycarriers come only from a source of the transistor. Accordingly, in thetransistor using the oxide semiconductor film, an avalanche breakdowndoes not occur.

Further, in the transistor using the oxide semiconductor film, thechannel region of the FET is completely depleted by the electric fieldof the gate electrode; therefore, for example, the off-state currentwhen the channel length is 3 μm and the channel width is 1 μm can besuppressed to be less than or equal to 1×10⁻²³ A at 85° C. to 95° C. andto be less than or equal to 1×10⁻²⁵ A at a room temperature.

The second conductive film 116 a and the third conductive film 126 a atleast partly serve as a source electrode and a drain electrode of thetransistor using the first oxide semiconductor film 106 a. As the secondconductive film 116 a and the third conductive film 126 a, a filmselected from the conductive films given as examples of the firstconductive film 104 a may be used.

The third insulating film 110 a at least partly serves as a gateinsulating film. As the third insulating film 110 a, a film selectedfrom the insulating films given as examples of the second insulatingfilm 112 a may be used.

The fourth conductive film 114 serves as a second gate electrode in thetransistor using the first oxide semiconductor film 106 a. As the fourthconductive film 114, a film selected from the conductive films given asexamples of the first conductive film 104 a may be used.

Note that formation of a channel in the first oxide semiconductor film106 a depends on the balance between voltage applied to the fourthconductive film 114 and voltage applied to the first conductive film 104a. For example, when negative voltage is applied to the fourthconductive film 114, even when voltage corresponding to the thresholdvoltage (Vth) of the transistor is applied to the first conductive film104 a, a channel is not formed in the first oxide semiconductor film 106a. In this case, when voltage which is higher than the threshold voltage(Vth) of the transistor by the negative voltage applied to the fourthconductive film 114 is applied to the first conductive film 104 a, achannel is formed. The same can be said to the case where the fourthconductive film 114 and the first conductive film 104 a are replacedwith each other. Needless to say, the balance between voltage applied tothe first gate electrode and voltage applied to the second gateelectrode varies depending on the thickness or the dielectric constantof the gate insulating film.

Accordingly, in the case where the transistor has normally-oncharacteristics (the threshold voltage Vth is negative), negativevoltage is sufficiently applied to the first conductive film 104 a orthe fourth conductive film 114 so that the threshold voltage can bepositive, whereby the transistor can have normally-off characteristics(the threshold voltage Vth is positive). It is preferable that thethreshold voltage Vth of the transistor be controlled by the fourthconductive film 114.

The fourth insulating film 120 a serves as a planarization film.Accordingly, the films provided above the fourth insulating film 120 aare less likely to be affected by unevenness generated by the filmsprovided below the fourth insulating film 120 a. Thus, a decrease inwithstand voltage, disconnection, or the like, which is caused by theunevenness, can be prevented. In other words, the fourth insulating film120 a is an insulating film having a function of reducing the unevennessof the semiconductor device. Note that in the case where unevennessgenerated by the films provided below the fourth insulating film 120 ais minor, the fourth insulating film 120 a is not necessarily provided.

The fourth insulating film 120 a may be formed of a single layer or astacked layer of an insulating film(s) containing any of aluminum oxide,aluminum nitride, magnesium oxide, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, germanium oxide, yttrium oxide,zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, andtantalum oxide.

The fourth insulating film 120 a may also be formed using an organicresin such as acrylic, epoxy, or polyimide. An organic resin can beformed by a spin coating method or the like, and thus a relativelyplanar upper surface is easily obtained.

The fifth insulating film 110 b at least partly serves as a gateinsulating film. As the fifth insulating film 110 b, a film selectedfrom the insulating films given as examples of the second insulatingfilm 112 a may be used.

The second oxide semiconductor film 106 b includes a channel region in aregion which overlaps with the seventh conductive film 104 b. As thesecond oxide semiconductor film 106 b, a film selected from the compoundfilms given as examples of the first oxide semiconductor film 106 a maybe used.

The fifth conductive film 116 b and the sixth conductive film 126 b atleast partly serve as a source electrode and a drain electrode in atransistor using the second oxide semiconductor film 106 b. As the fifthconductive film 116 b and the sixth conductive film 126 b, a filmselected from the conductive films given as examples of the firstconductive film 104 a may be used.

The sixth insulating film 112 b serves as a gate insulating film. As thesixth insulating film 112 b, a film selected from the insulating filmsgiven as examples of the second insulating film 112 a may be used.

The seventh conductive film 104 b at least partly serves as a first gateelectrode in the transistor using the second oxide semiconductor film106 b. As the seventh conductive film 104 b, a film selected from theconductive films given as examples of the first conductive film 104 amay be used.

Note that formation of a channel in the second oxide semiconductor film106 b depends on the balance between voltage applied to the fourthconductive film 114 and voltage applied to the seventh conductive film104 b. For example, when negative voltage is applied to the fourthconductive film 114, even when voltage corresponding to the thresholdvoltage Vth of the transistor is applied to the seventh conductive film104 b, a channel is not formed in the second oxide semiconductor film106 b. In this case, when voltage which is higher than the thresholdvoltage Vth of the transistor by the negative voltage applied to thefourth conductive film 114 is applied to the seventh conductive film 104b, a channel is formed. The same can be said to the case where thefourth conductive film 114 and the seventh conductive film 104 b arereplaced with each other.

Accordingly, in the case where the transistor has normally-oncharacteristics, negative voltage is sufficiently applied to the seventhconductive film 104 b or the fourth conductive film 114 so that thethreshold voltage Vth can be positive, whereby the transistor can havenormally-off characteristics.

Thus, the threshold voltage Vth of the first oxide semiconductor film106 a and the second oxide semiconductor film 106 b can be controlled bythe fourth conductive film 114. In other words, one second gateelectrode (here, the fourth conductive film 114) serves as the secondgate electrode both for the transistor using the first oxidesemiconductor film 106 a and the transistor using the second oxidesemiconductor film 106 b. Accordingly, the second gate electrode can beshared between the transistors of the semiconductor device, eachincluding gate electrodes above and below its oxide semiconductor layer.

Note that the seventh insulating film 120 b serves as a planarizationfilm. Accordingly, films provided above the seventh insulating film 120b are less likely to be affected by unevenness generated by the filmsprovided below the seventh insulating film 120 b. Thus, a decrease inwithstand voltage, disconnection, or the like, which is caused by theunevenness, can be prevented. In other words, the seventh insulatingfilm 120 b is an insulating film having a function of reducing theunevenness of the semiconductor device.

The seventh insulating film 120 b enables a stack of the plurality ofstructures of the semiconductor device described in this embodiment(here, the structure including the components from the first insulatingfilm 102 to the seventh insulating film 120 b). Specifically, the numberof the structures which are stacked is 2 or more and 10 or less,preferably 3 or more and 20 or less, more preferably 5 or more and 50 orless. Needless to say, the number of the structures which are stackedmay be set beyond 50.

In the case where the plurality of structures of the semiconductordevice described in this embodiment are stacked, one conductive filmserving as the second gate electrode is provided per two transistors.Accordingly, the number of steps for forming second gate electrodes canbe reduced. In other words, one conductive film serving as a second gateelectrode can be omitted per structure. Thus, in the case where theplurality of structures are provided so as to be stacked, breaking dueto stress during manufacture of the semiconductor device can besuppressed, so that a semiconductor device including more transistorscan be manufactured. In other words, the semiconductor device can behighly integrated and the yield can be improved.

Next, a method for manufacturing the semiconductor device illustrated inFIG. 1B will be described with reference to FIGS. 2A to 2D, FIGS. 3A to3C, FIGS. 4A to 4C, FIGS. 5A and 5B, and FIGS. 6A and 6B.

First, the substrate 101 is prepared.

Next, the first insulating film 102 is formed over the substrate 101(see FIG. 2A). The first insulating film 102 can be formed by asputtering method, a chemical vapor deposition (CVD) method, a molecularbeam epitaxy (MBE) method, an atomic layer deposition (ALD) method, or apulsed laser deposition (PLD) method, for example.

Next, a conductive film is formed and processed to form the firstconductive film 104 a (see FIG. 2B). The conductive film may be formedby a sputtering method, a CVD method, an MBE method, an ALD method, or aPLD method, for example.

Note that the simple term “processed” means in this specification thatthe film is formed into a desired shape using a resist mask formed by aphotolithography process, for example.

Next, the second insulating film 112 a is formed (see FIG. 2C). Thesecond insulating film 112 a can be formed by a sputtering method, a CVDmethod, an MBE method, an ALD method, or a PLD method, for example.

Next, an oxide semiconductor film is formed and then processed to formthe first oxide semiconductor film 106 a (see FIG. 2D). The oxidesemiconductor film may be formed by a sputtering method, a CVD method,an MBE method, an ALD method, or a PLD method, for example.

Next, a conductive film is formed and then processed to form the secondconductive film 116 a and the third conductive film 126 a (see FIG. 3A).The conductive film may be formed by a sputtering method, a CVD method,an MBE method, an ALD method, or a PLD method, for example.

Then, the third insulating film 110 a is formed (see FIG. 3B). The thirdinsulating film 110 a can be formed by a sputtering method, a CVDmethod, an MBE method, an ALD method, or a PLD method, for example.

Next, a conductive film is formed and then processed to form aconductive film 124 (see FIG. 3C). The conductive film may be formed bya sputtering method, a CVD method, an MBE method, an ALD method, or aPLD method, for example.

Next, an insulating film 130 a is formed (see FIG. 4A). The insulatingfilm 130 a may be formed by a spin coating method, a sputtering method,a CVD method, an MBE method, an ALD method, or a PLD method, forexample.

Next, the insulating film 130 a and the conductive film 124 are removedfrom the upper surfaces so that they have planarity, so that the fourthinsulating film 120 a and the fourth conductive film 114 whose uppersurfaces are level with each other are formed (see FIG. 4B). Note thatthe insulating film 130 a and the conductive film 124 are formed to havea sufficient thickness in advance, which makes it easy to form thefourth insulating film 120 a and the fourth conductive film 114 whoseupper surfaces are level with each other.

As a method for removing the insulating film 130 a and the conductivefilm 124 from the upper surfaces so that they have planarity, a chemicalmechanical polishing (CMP) method may be used, for example.

Then, the fifth insulating film 110 b is formed (see FIG. 4C). The fifthinsulating film 110 b may be formed by a sputtering method, a CVDmethod, an MBE method, an ALD method, or a PLD method, for example.

Next, an oxide semiconductor film is formed and then processed to formthe second oxide semiconductor film 106 b (see FIG. 5A). The oxidesemiconductor film may be formed by a sputtering method, a CVD method,an MBE method, an ALD method, or a PLD method, for example.

Next, a conductive film is formed and then processed to form the fifthconductive film 116 b and the sixth conductive film 126 b (see FIG. 5B).The conductive film may be formed by a sputtering method, a CVD method,an MBE method, an ALD method, or a PLD method, for example.

Next, the sixth insulating film 112 b is formed (see FIG. 6A). The sixthinsulating film 112 b may be formed by a sputtering method, a CVDmethod, an MBE method, an ALD method, or a PLD method, for example.

Next, a conductive film is formed and then processed to form the seventhconductive film 104 b (see FIG. 6B). The conductive film may be formedby a sputtering method, a CVD method, an MBE method, an ALD method, or aPLD method, for example.

Next, the seventh insulating film 120 b is formed. In this manner, thesemiconductor device illustrated in FIG. 1B is manufactured. The seventhinsulating film 120 b may be formed by a spin coating method, asputtering method, a CVD method, an MBE method, an ALD method, or a PLDmethod, for example.

Note that in order to planarize an upper surface of the seventhinsulating film 120 b, CMP or the like may be performed thereon.

Note that in a step before or after any of the respective processingsfor forming the first oxide semiconductor film 106 a and the secondoxide semiconductor film 106 b, heat treatment may be performed at atemperature higher than or equal to 100° C. and lower than or equal to450° C., preferably higher than or equal to 150° C. and lower than orequal to 400° C., more preferably higher than or equal to 200° C. andlower than or equal to 350° C. Further, when the oxide semiconductorfilm serving as the first oxide semiconductor film 106 a or the secondoxide semiconductor film 106 b is formed, the substrate temperature maybe higher than or equal to 100° C. and lower than or equal to 450° C.,preferably higher than or equal to 150° C. and lower than or equal to400° C., more preferably higher than or equal to 200° C. and lower thanor equal to 350° C. By the heat treatment and/or the formation method,hydrogen, halogen, a metal element which is not a main component, anoxygen vacancy, or the like in the first oxide semiconductor film 106 aor the second oxide semiconductor film 106 b can be reduced, so that asemiconductor device having excellent characteristics and highreliability can be manufactured.

Since the semiconductor device manufactured as described above has aplanar upper surface, a plurality of structures similar to the structureof the semiconductor device can be provided so as to be stacked. Forexample, when a structure including the components from the firstinsulating film 102 to the seventh insulating film 120 b in FIG. 17A isreferred to as A structure (this structure corresponds to the structurein FIG. 1B), the plurality of A structures may be stacked as illustratedin FIG. 17B. Accordingly, the degree of integration of the semiconductordevice can be increased. Further, the number of the layers for formingthe second gate electrodes in the transistors each including gateelectrodes above and below the oxide semiconductor layer can be madesmall, and thus stress can be prevented from being increased even whenthe plurality of structures similar to the structure of thesemiconductor device are stacked. In other words, even when the degreeof integration of the semiconductor device is increased, the yield ofthe semiconductor device is not decreased.

This embodiment can be implemented in appropriate combination with anyof the other embodiments.

Embodiment 2

In this embodiment, a semiconductor device having a structure differentfrom that of the semiconductor device in Embodiment 1 will be describedwith reference to FIGS. 7A and 7B, FIG. 8, FIGS. 9A to 9D, FIGS. 10A to10C, FIGS. 11A to 11C, FIGS. 12A and 12B, FIGS. 13A and 13B, FIGS. 14Aand 14B, and FIG. 15.

FIG. 7A is a top view of a semiconductor device of one embodiment of thepresent invention. Note that FIG. 7B is a cross-sectional view takenalong dashed-dotted line A-B in FIG. 7A. In FIG. 7A, a film which is notseen due to overlap, an insulating film, and the like, are omitted forsimplicity.

The semiconductor device illustrated in FIG. 7B includes a firstconductive film 204 a provided over a first insulating film 202 which isprovided over a substrate 201; a second insulating film 212 a providedover the first conductive film 204 a and the first insulating film 202;a first oxide semiconductor film 206 a which is provided over the secondinsulating film 212 a and at least partly overlaps with the firstconductive film 204 a; a second conductive film 216 a and a thirdconductive film 226 a which are provided over the first oxidesemiconductor film 206 a; a third insulating film 210 a provided overthe second conductive film 216 a, the third conductive film 226 a, andthe first oxide semiconductor film 206 a; a fourth conductive film 234 awhich is provided over the third insulating film 210 a and at leastpartly overlaps with the second conductive film 216 a; a fifthconductive film 214 which is provided over the third insulating film 210a and at least partly overlaps with the first oxide semiconductor film206 a and the first conductive film 204 a; a fourth insulating film 220a which is provided over the third insulating film 210 a and whose uppersurface is level with upper surfaces of the fourth conductive film 234 aand the fifth conductive film 214; a fifth insulating film 210 bprovided over the fourth conductive film 234 a, the fifth conductivefilm 214, and the fourth insulating film 220 a; a second oxidesemiconductor film 206 b which is provided over the fifth insulatingfilm 210 b and at least partly overlaps with the fifth conductive film214; a sixth conductive film 216 b which is provided over the secondoxide semiconductor film 206 b and at least partly overlap with thesecond conductive film 216 a; a seventh conductive film 226 b which isprovided over the second oxide semiconductor film 206 b and at leastpartly overlap with the third conductive film 226 a; a sixth insulatingfilm 212 b provided over the sixth conductive film 216 b, the seventhconductive film 226 b, and the second oxide semiconductor film 206 b; aneighth conductive film 234 b which is provided over the sixth insulatingfilm 212 b and at least partly overlaps with the sixth conductive film216 b; a ninth conductive film 204 b which is provided over the sixthinsulating film 212 b and at least partly overlaps with the second oxidesemiconductor film 206 b and the fifth conductive film 214; a seventhinsulating film 220 b provided over the eighth conductive film 234 b,the ninth conductive film 204 b, and the sixth insulating film 212 b;and a tenth conductive film 260 provided over the seventh insulatingfilm 220 b. Note that an opening reaching the third conductive film 226a is formed in the seventh insulating film 220 b, the sixth insulatingfilm 212 b, the seventh conductive film 226 b, the second oxidesemiconductor film 206 b, the fifth insulating film 210 b, the fourthinsulating film 220 a, and the third insulating film 210 a. The tenthconductive film 260 and the third conductive film 226 a are in contactwith each other through the opening. Note that an eighth insulating film225 having a planar upper surface is preferably provided over the tenthconductive film 260 and the seventh insulating film 220 b.

Here, the description of the substrate 101 can be referred to for thesubstrate 201. The description of the first insulating film 102 can bereferred to for the first insulating film 202. The description of thefirst conductive film 104 a can be referred to for the first conductivefilm 204 a. The description of the second insulating film 112 a can bereferred to for the second insulating film 212 a. The description of thefirst oxide semiconductor film 106 a can be referred to for the firstoxide semiconductor film 206 a. The description of the second conductivefilm 116 a can be referred to for the second conductive film 216 a. Thedescription of the third conductive film 126 a can be referred to forthe third conductive film 226 a. The description of the third insulatingfilm 110 a can be referred to for the third insulating film 210 a. Thedescription of the fourth conductive film 114 can be referred to for thefifth conductive film 214. The description of the fourth insulating film120 a can be referred to for the fourth insulating film 220 a. Thedescription of the fifth insulating film 110 b can be referred to forthe fifth insulating film 210 b. The description of the second oxidesemiconductor film 106 b can be referred to for the second oxidesemiconductor film 206 b. The description of the fifth conductive film116 b can be referred to for the sixth conductive film 216 b. Thedescription of the sixth conductive film 126 b can be referred to forthe seventh conductive film 226 b. The description of the sixthinsulating film 112 b can be referred to for the sixth insulating film212 b. The description of the seventh conductive film 104 b can bereferred to for the ninth conductive film 204 b. The description of theseventh insulating film 120 b can be referred to for the seventhinsulating film 220 b.

The fourth conductive film 234 a is provided in the same layer as thefifth conductive film 214.

The eighth conductive film 234 b is provided in the same layer as theninth conductive film 204 b.

The tenth conductive film 260 serves as a bit line of a memory. A sidesurface of the tenth conductive film 260 is in contact with the seventhconductive film 226 b. As the tenth conductive film 260, a film selectedfrom the conductive films given as examples of the second conductivefilm 216 a may be used.

Further, the first conductive film 204 a and the ninth conductive film204 b each serve as a word line of the memory.

Furthermore, the fifth conductive film 214 serves as a second gateelectrode of a transistor using the first oxide semiconductor film 206 aand a transistor using the second oxide semiconductor film 206 b.

In FIG. 8, a circuit diagram of the semiconductor device formed asdescribed above is illustrated. FIG. 8 is a circuit diagram of a memoryin which one transistor is provided per capacitor.

When FIG. 7B and FIG. 8 are compared, the first conductive film 204 a atleast partly serves as a first word line WL1; the fourth conductive film234 a at least partly serves as a first capacitor line CL1; the fifthconductive film 214 at least partly serves as a back gate line BG; theeighth conductive film 234 b at least partly serves as a secondcapacitor line CL2; the ninth conductive film 204 b at least partlyserves as a second word line WL2; and the tenth conductive film 260 atleast partly serves as a bit line BL.

Further, a capacitor C1 in FIG. 8 corresponds to a capacitor 270 a inFIG. 7B. The capacitor 270 a includes at least part of the secondconductive film 216, at least part of the third insulating film 210 a,and at least part of the fourth conductive film 234 a. A capacitor C2 inFIG. 8 corresponds to a capacitor 270 b in FIG. 7B. The capacitor 270 bincludes at least part of the sixth conductive film 216 b, at least partof the sixth insulating film 212 b, and at least part of the eighthconductive film 234 b.

A transistor Tr1 in FIG. 8 corresponds to a transistor 271 a in FIG. 7B.The transistor 271 a includes at least part of the first conductive film204 a, at least part of the first oxide semiconductor film 206 a, atleast part of the second conductive film 216 a, at least part of thethird conductive film 226 a, and at least part of the fifth conductivefilm 214. A transistor Tr2 in FIG. 8 corresponds to a transistor 271 bin FIG. 7B. The transistor 271 b includes at least part of the ninthconductive film 204 b; at least part of the second oxide semiconductorfilm 206 b; at least part of the sixth conductive film 216 b; at leastpart of the seventh conductive film 226 b; and at least part of thefifth conductive film 214.

A memory cell MC1 includes the transistor Tr1 and the capacitor C1. Amemory cell MC2 includes the transistor Tr2 and the capacitor C2.

Note that the memory cell MC1 and the memory cell MC2 are provided so asto at least partly overlap with each other. Here, in FIG. 7A, the areaof a memory cell 280 is 2F×4F, that is 8F². However, the memory cell MC1and the memory cell MC2 are provided in the area. Accordingly, in thecase where the memory cell MC1 and the memory cell MC2 completelyoverlap with each other, the area per memory cell can be regarded as4F², which is a half of 8F².

Note that the semiconductor device illustrated in FIG. 7B includes theeighth insulating film 225 having a planar upper surface as an uppermostlayer. Therefore, a plurality of structures similar to the structure ofthe semiconductor device in FIG. 7B can be provided so as to be stacked.In the case where two structures of the semiconductor device in FIG. 7Bare stacked and four memory cells are provided so as to completelyoverlap with each other in an area of 8 F², the area per memory can beregarded as 2F², which is one-quarter of 8F².

As described above, when the plurality of structures of thesemiconductor device in FIG. 7B are provided so as to be stacked, thearea per memory cell can be reduced, so that a memory having largestorage capacity per unit area can be manufactured. Further, the yieldof the semiconductor device is not decreased even when the degree ofintegration of the semiconductor device is increased.

Note that although FIG. 8 is a circuit diagram showing part of thememory, the scale can be expanded, so that a memory cell array in whicha plurality of memory cells MC1 and memory cells MC2 are arranged in thesame plane can be obtained.

Methods for wiring and reading data to/from the memory cell array willbe described below.

A method for writing data to the memory cell array will be described.Data writing is performed on every memory cell. Specifically, apotential of the word line in a row which is selected arbitrarily is setto VH (potential higher than the sum of the threshold voltage (Vth) of atransistor and VDD (power supply potential)), and potentials of wordlines in the other rows are set to GND (or lower than GND). Next, apotential of a bit line in a column which is selected arbitrarily is setto VDD, and the bit lines in the other columns are set to a floatingpotential (float). As a result, VDD is stored in a capacitor which is ina memory cell in the selected row and which is connected to the bit linein the selected column. Then, the potential of the word line in theselected row is set to GND (or lower than GND), whereby data is storedin the memory cell. After that, data is sequentially written to othermemory cells. This is the method for wiring data to the memory cellarray.

Alternatively, data writing is performed per row. For example, to writedata to the memory cells at theist row, the potential VH is applied tothe word line in the first row, and then, the potential VDD is appliedto the bit line at each column of the memory cell(s) to which data 1 iswritten, whereas the potential GND is applied to the bit line at eachcolumn of the memory cell(s) to which data 0 is written. Then, thepotential of the word line is changed to GND (or a potential lower thanGND), whereby data is held in the capacitor. This operation is performedrow by row, whereby data can be written in all memory cells. This is themethod for wiring data to the memory cell array.

Low off-state current of the transistor using an oxide semiconductorfilm, which is one embodiment of the present invention, enables datawritten to the memory cell in this manner to be stored for a long time.

Then, a method for reading data will be described. Data reading isperformed on every memory cell. First, a potential of a bit line in acolumn which is selected arbitrarily is set to a predetermined potential(fixed potential). Next, a potential of a word line in a row which isselected arbitrarily is set to VH, whereby a potential corresponding todata written to the capacitor is given to the bit line which isselected. After that, the given potential is read by a sense amplifier(not illustrated). Note that data is lost at the same time data is read.However, the operation of the sense amplifier amplifies the potential,so that data is written to the memory cell again. After that, data issequentially read from other memory cells.

Alternatively, data reading is performed per row. For example, in thecase where data in the memory cells in the first row are read,potentials of all the bit lines are set to a predetermined potential (afixed potential). Next, potentials of the word line in the first row areset to VH, so that the potential of each of the bit lines is changeddepending on data. This operation is performed row by row, whereby datacan be read out from all the memory cells. This is the method forreading data from the memory cell array.

Here, a method for manufacturing the semiconductor device illustrated inFIG. 7B will be described with reference to FIGS. 9A to 9D, FIGS. 10A to10C, FIGS. 11A to 11C, FIGS. 12A and 12B, FIGS. 13A and 13B, FIGS. 14Aand 14B, and FIG. 15.

First, the substrate 201 is prepared.

Next, the first insulating film 202 is formed over the substrate 201(see FIG. 9A).

Then, a conductive film is formed and then processed to form the firstconductive film 204 a (see FIG. 9B).

After that, the second insulating film 212 a is formed (see FIG. 9C).

Next, an oxide semiconductor film is formed and then processed, so thatthe first oxide semiconductor film 206 a is formed (see FIG. 9D).

Subsequently, a conductive film is formed and then processed, so thatthe second conductive film 216 a and the third conductive film 226 a areformed (see FIG. 10A).

Then, the third insulating film 210 a is formed (see FIG. 10B).

Next, a conductive film is formed and then processed, so that aconductive film 244 a and a conductive film 254 are formed (see FIG.10C).

Next, an insulating film 250 a is formed (see FIG. 11A).

Next, the insulating film 250 a, the conductive film 244 a, and theconductive film 254 are etched from the upper surfaces by CMP or thelike, whereby the fourth insulating film 220 a, the fourth conductivefilm 234 a, and the fifth conductive film 214, whose upper surfaces arelevel with one another, are formed (see FIG. 11B). Note that when theinsulating film 250 a, the conductive film 244 a, and the conductivefilm 254 are formed to have a sufficient thickness in advance, whichmakes it easy to form the fourth insulating film 220 a, the fourthconductive film 234 a, and the fifth conductive film 214, whose uppersurfaces are level with one another.

Next, the fifth insulating film 210 b is formed (see FIG. 11C).

Next, an oxide semiconductor film is formed and then processed, so thatthe second oxide semiconductor film 206 b is formed (see FIG. 12A).

Next, a conductive film is formed and then processed, so that the sixthconductive film 216 b and the seventh conductive film 226 b are formed(see FIG. 12B).

Next, the sixth insulating film 212 b is formed (see FIG. 13A).

Next, a conductive film is formed and then processed, so that the eighthconductive film 234 b and the ninth conductive film 204 b are formed(see FIG. 13B).

Next, the seventh insulating film 220 b is formed (see FIG. 14A).

Next, the seventh insulating film 220 b, the sixth insulating film 212b, the seventh conductive film 226 b, the second oxide semiconductorfilm 206 b, the fifth insulating film 210 b, the fourth insulating film220 a, and the third insulating film 210 a are each partly etched toform the opening through which the third conductive film 226 a isexposed (see FIG. 14B).

Next, a conductive film is formed and then processed, so that the tenthconductive film 260 is formed (see FIG. 15).

Next, the eighth insulating film 225 is formed. Thus, the semiconductordevice illustrated in FIG. 7B is manufactured.

Note that in order to planarize a surface of the eighth insulating film225, CMP or the like may be performed thereon.

Since the semiconductor device manufactured as described above has aplanar upper surface, the plurality of structures similar to thestructure of the semiconductor device can be provided so as to bestacked as exemplified in FIG. 17B, so that the degree of integration ofthe semiconductor device can be increased. Further, the number of thelayers used for the second gate electrodes can be reduced, and thusstress can be prevented from being increased even when the plurality ofstructures similar to the structure of the semiconductor device arestacked. In other words, even when the degree of integration of thesemiconductor device is increased, the yield of the semiconductor deviceis not decreased.

This embodiment can be implemented in appropriate combination with anyof the other embodiments.

Embodiment 3

In this embodiment, a semiconductor device having a structure differentfrom those of the semiconductor devices in Embodiments 1 and 2 will bedescribed with reference to FIGS. 16A and 16B.

FIG. 16A is a top view of a semiconductor device of one embodiment ofthe present invention. A cross-sectional view taken along dashed-dottedline A-B in FIG. 16A is FIG. 16B. In FIG. 16A, a film which is not seendue to overlap, an insulating film, and the like, are omitted forsimplicity.

A structure from the substrate 201 to the fifth insulating film 210 b ina transistor illustrated in FIG. 16B is the same as that in thetransistor illustrated in FIG. 7B. Therefore, Embodiment 2 can bereferred to for the description of the components from the substrate 201to the fifth insulating film 210 b.

The semiconductor device illustrated in FIG. 16B includes the firstconductive film 204 a provided over the first insulating film 202 whichis provided over the substrate 201; the second insulating film 212 aprovided over the first conductive film 204 a and the first insulatingfilm 202; the first oxide semiconductor film 206 a which is providedover the second insulating film 212 a and at least partly overlaps withthe first conductive film 204 a; the second conductive film 216 a andthe third conductive film 226 a which are provided over the first oxidesemiconductor film 206 a; the third insulating film 210 a provided overthe second conductive film 216 a, the third conductive film 226 a, andthe first oxide semiconductor film 206 a; the fourth conductive film 234a which is provided over the third insulating film 210 a and at leastpartly overlaps with the second conductive film 216 a; the fifthconductive film 214 which is provided over the third insulating film 210a and at least partly overlaps with the first oxide semiconductor film206 a and the first conductive film 204 a; the fourth insulating film220 a which is provided over the third insulating film 210 a and whoseupper surface is level with upper surfaces of the fourth conductive film234 a and the fifth conductive film 214; the fifth insulating film 210 bprovided over the fourth conductive film 234 a, the fifth conductivefilm 214, and the fourth insulating film 220 a; a sixth conductive film216 c which is provided over the fifth insulating film 210 b and atleast partly overlap with the second conductive film 216 a; a seventhconductive film 226 c which is provided over the fifth insulating film210 b and at least partly overlap with the third conductive film 226 a;a second oxide semiconductor film 206 c which is provided over the sixthconductive film 216 c, the seventh conductive film 226 c, and the fifthinsulating film 210 b and which at least partly overlaps with the fifthconductive film 214; a sixth insulating film 212 c provided over thesecond oxide semiconductor film 206 c; an eighth conductive film 204 cwhich is provided over the sixth insulating film 212 c and at leastpartly overlap with the second oxide semiconductor film 206 c and thefifth conductive film 214; a seventh insulating film 220 c provided overthe eighth conductive film 204 c and the sixth insulating film 212 c;and a ninth conductive film 261 provided over the seventh insulatingfilm 220 c. Note that an opening reaching the third conductive film 226a is formed in the seventh insulating film 220 c, the sixth insulatingfilm 212 c, the seventh conductive film 226 c, the second oxidesemiconductor film 206 c, the fifth insulating film 210 b, the fourthinsulating film 220 a, and the third insulating film 210 a. The ninthconductive film 261 and the third conductive film 226 a are in contactwith each other through the opening. Note that an eighth insulating film226 having a planar upper surface is preferably provided over the ninthconductive film 261 and the seventh insulating film 220 c.

Here, the description of the sixth conductive film 216 b can be referredto for the sixth conductive film 216 c. The description of the seventhconductive film 226 b can be referred to for the seventh conductive film226 c. The description of the second oxide semiconductor film 206 b canbe referred to for the second oxide semiconductor film 206 c. Thedescription of the sixth insulating film 212 b can be referred to forthe sixth insulating film 212 c. The description of the ninth conductivefilm 204 b can be referred to for the eighth conductive film 204 c. Thedescription of the seventh insulating film 220 b can be referred to forthe seventh insulating film 220 c. The description of the tenthconductive film 260 can be referred to for the ninth conductive film261. The description of the eighth insulating film 225 can be referredto for the eighth insulating film 226.

The capacitor 270 a in FIG. 16B corresponds to the capacitor C1 in FIG.8. The capacitor 270 a includes at least part of the second conductivefilm 216 a, at least part of the third insulating film 210 a, and atleast part of the fourth conductive film 234 a. Further, the capacitorC2 in FIG. 8 corresponds to a capacitor 270 c in FIG. 16B. The capacitor270 c includes at least part of the sixth conductive film 216 c, atleast part of the fifth insulating film 210 b, and at least part of thefourth conductive film 234 a. In other words, the semiconductor devicehas a structure in which the capacitor line CL2 is not provided and thecapacitor C2 is connected to the capacitor line CL1 in FIG. 8.

Further, the transistor Tr1 in FIG. 8 corresponds to the transistor 271a in FIG. 16B. The transistor 271 a includes at least part of the firstconductive film 204 a, at least part of the first oxide semiconductorfilm 206 a, at least part of the second conductive film 216 a, at leastpart of the third conductive film 226 a, and at least part of the fifthconductive film 214. The transistor Tr2 in FIG. 8 corresponds to atransistor 271 c in FIG. 16B. The transistor 271 c includes at leastpart of the eighth conductive film 204 c, at least part of the secondoxide semiconductor film 206 c, at least part of the sixth conductivefilm 216 c, at least part of the seventh conductive film 226 c, and atleast part of the fifth conductive film 214.

In other words, the number of the conductive films in the semiconductordevice in this embodiment can be reduced by one as compared to that inthe semiconductor device in Embodiment 2. Note that the area of a memorycell 281 is the same as that of the memory cell 280.

The description in Embodiment 2 can be referred to for methods forwriting and reading data to/from the memory cell.

Since the semiconductor device manufactured as described above has aplanar upper surface, the plurality of structures similar to thestructure of the semiconductor device can be provided so as to bestacked as exemplified in FIG. 17B. Accordingly, the degree ofintegration of the semiconductor device can be increased. Further, thenumber of the layers used for the second gate electrodes of thetransistors each including gate electrodes above and below its oxidesemiconductor layer can be made small, and thus stress can be preventedfrom being increased even when the plurality of structures similar tothe structure of the semiconductor device are stacked. In other words,the yield of the semiconductor device is not decreased even when thedegree of integration of the semiconductor device is increased.

This embodiment can be implemented in appropriate combination with anyof the other embodiments.

Embodiment 4

In this embodiment, examples of electronic devices to which any ofEmbodiments 1 to 3 is applied will be described.

FIG. 18A illustrates a portable information terminal. The portableinformation terminal illustrated in FIG. 18A includes a housing 9300, abutton 9301, a microphone 9302, a display portion 9303, a speaker 9304,and a camera 9305, and has a function as a mobile phone. One embodimentof the present invention can be applied to the display portion 9303 andthe camera 9305. Although not illustrated, an embodiment of the presentinvention can also be applied to an arithmetic unit, a wireless circuit,or a memory circuit inside the main body.

FIG. 18B illustrates a digital still camera. The digital still cameraillustrated in FIG. 18B includes a housing 9320, a button 9321, amicrophone 9322, and a display portion 9323. One embodiment of thepresent invention can be applied to a memory circuit inside the digitalstill camera.

FIG. 18C illustrates a double-foldable portable information terminal.The double-foldable portable information terminal illustrated in FIG.18C includes a housing 9630, a display portion 9631 a, a display portion9631 b, a hinge 9633, and an operation switch 9638.

Part or whole of the display portion 9631 a and/or the display portion9631 b can function as a touch panel. By touching an operation keydisplayed on the touch panel, a user can input data, for example.

By using a semiconductor device of one embodiment of the presentinvention, the performance of an electronic device can be improved andthe reliability of the electronic device can be improved.

This embodiment can be implemented in appropriate combination with anyof the other embodiments.

This application is based on Japanese Patent Application serial no.2011-263867 filed with Japan Patent Office on Dec. 1, 2011, the entirecontents of which are hereby incorporated by reference.

1. (canceled)
 2. A semiconductor device comprising: a first transistorincluding an oxide semiconductor in a channel formation region, thefirst transistor comprising: a first gate electrode; and a back gateelectrode; and a second transistor including an oxide semiconductor in achannel formation region, the second transistor comprising: the backgate electrode; and a second gate electrode.
 3. The semiconductor deviceaccording to claim 2, wherein the back gate electrode at least partlyoverlaps with the first gate electrode, and wherein the second gateelectrode at least partly overlaps with the back gate electrode.
 4. Thesemiconductor device according to claim 2, wherein a voltage applied tothe first gate electrode and a voltage applied to the second gateelectrode are higher than a voltage applied to the back gate electrode.5. The semiconductor device according to claims 2, wherein the oxidesemiconductor in the first transistor is c-axis aligned crystallineoxide semiconductor, and wherein the oxide semiconductor in the secondtransistor is c-axis aligned crystalline oxide semiconductor.
 6. Thesemiconductor device according to claim 2, further comprising a firststructure and a second structure at least partly stacked over the firststructure, wherein each of the first structure and the second structureincludes the first transistor and the second transistor.
 7. Asemiconductor device comprising: a first word line; a second word line;a back gate line; a first transistor on an insulating surface, the firsttransistor comprises: a first conductive film electrically connected tothe first word line; a first insulating film over the first conductivefilm; a first oxide semiconductor film over the first insulating film; asecond conductive film at least partly in contact with the first oxidesemiconductor film; a third conductive film at least partly in contactwith the first oxide semiconductor film; a second insulating film overthe first oxide semiconductor film, the second conductive film, and thethird conductive film; and a fourth conductive film over the secondinsulating film, the fourth conductive film electrically connected tothe back gate line; and a second transistor at least partly overlappingwith the first transistor, the second transistor comprises: the fourthconductive film; a third insulating film over the fourth conductivefilm; a second oxide semiconductor film over the third insulating film;a fifth conductive film at least partly overlapping with the secondoxide semiconductor film; a sixth conductive film at least partlyoverlapping with the second oxide semiconductor film; a fourthinsulating film over the second oxide semiconductor film, the fifthconductive film, and the sixth conductive film; and a seventh conductivefilm over the fourth insulating film, the seventh conductive filmelectrically connected to the second word line, wherein the first oxidesemiconductor film at least partly overlaps with the first conductivefilm and the fourth conductive film, and wherein the second oxidesemiconductor film at least partly overlaps with the fourth conductivefilm and the seventh conductive film.
 8. The semiconductor deviceaccording to claim 7, wherein a voltage applied to the first word lineand a voltage applied to the second word line are higher than a voltageapplied to the back gate line.
 9. The semiconductor device according toclaim 7, further comprising a first structure and a second structure atleast partly stacked over the first structure, wherein each of the firststructure and the second structure includes the first transistor and thesecond transistor.
 10. The semiconductor device according to claim 7,further comprising a fifth insulating film over the seventh conductivefilm and the fourth insulating film, wherein the fifth insulating filmhas a planer upper surface.
 11. The semiconductor device according toclaim 7, wherein the first oxide semiconductor film includes c-axisaligned crystalline oxide semiconductor, and wherein the second oxidesemiconductor film includes c-axis aligned crystalline oxidesemiconductor.
 12. The semiconductor device according to claim 7,wherein the second insulating film is in contact with a side surface ofthe second conductive film, a side surface of the third conductive film,and a side surface of the first oxide semiconductor film, and whereinthe fourth insulating film is in contact with a side surface of thefifth conductive film, a side surface of the sixth conductive film, anda side surface of the second oxide semiconductor film.
 13. Asemiconductor device comprising: a first word line; a second word line;a back gate line; a first conductive film on an insulating surface, thefirst conductive film electrically connected to the first word line; afirst insulating film over the first conductive film; a first oxidesemiconductor film at least partly overlapping with the first conductivefilm with the first insulating film interposed therebetween; a secondconductive film over the first oxide semiconductor film; a thirdconductive film over the first oxide semiconductor film; a secondinsulating film over the first oxide semiconductor film, the secondconductive film, and the third conductive film; a fourth conductive filmover the second insulating film, the fourth conductive film at leastpartly overlapping with the first oxide semiconductor film, the fourthconductive film electrically connected to the back gate line; a fifthconductive film over the second insulating film, the fifth conductivefilm at least partly overlapping with the second conductive film; athird insulating film over the second insulating film, the fourthconductive film, and the fifth conductive film; a second oxidesemiconductor film over the third insulating film, the second oxidesemiconductor film at least partly overlapping with the fourthconductive film; a sixth conductive film adjacent to the second oxidesemiconductor film; a seventh conductive film adjacent to the secondoxide semiconductor film; a fourth insulating film over the second oxidesemiconductor film, the sixth conductive film, and the seventhconductive film; an eighth conductive film over the fourth insulatingfilm, the eighth conductive film at least partly overlapping with thesecond oxide semiconductor film, the eighth conductive film electricallyconnected to the second word line; a fifth insulating film over thefourth insulating film and the eighth conductive film; a ninthconductive film over the fifth insulating film; and an opening in thesecond insulating film, the third insulating film, the second oxidesemiconductor film, the seventh conductive film, the fourth insulatingfilm, and the fifth insulating film, the opening reaching the thirdconductive film, wherein the ninth conductive film is in contact withthe third conductive film through the opening.
 14. The semiconductordevice according to claim 13, wherein a voltage applied to the firstword line and a voltage applied to the second word line are higher thana voltage applied to the back gate line.
 15. The semiconductor deviceaccording to claim 13, further comprising a tenth conductive filmbetween the fourth insulating film and the fifth insulating film, thetenth conductive film at least partly overlapping with the sixthconductive film.
 16. The semiconductor device according to claim 13,wherein each of the sixth conductive film and the seventh conductivefilm is located over the second oxide semiconductor film.
 17. Thesemiconductor device according to claim 13, wherein each of the sixthconductive film and the seventh conductive film is located under thesecond oxide semiconductor film.
 18. The semiconductor device accordingto claim 13, further comprising a sixth insulating film over the ninthconductive film, the sixth insulating film having a planer uppersurface.
 19. The semiconductor device according to claim 13, wherein apart of the first conductive film, a part of the first insulating film,a part of the first oxide semiconductor film, a part of the secondconductive film, a part of the third conductive film, a part of thesecond insulating film, and a part of the fourth conductive film areincluded in a first transistor, and wherein a part of the fourthconductive film, a part of the third insulating film, a part of thesecond oxide semiconductor film, a part of the sixth conductive film, apart of the seventh conductive film, and a part of the eighth conductivefilm are included in a second transistor.
 20. The semiconductor deviceaccording to claim 19, further comprising a first structure and a secondstructure at least partly stacked over the first structure, wherein eachof the first structure and the second structure includes the firsttransistor and the second transistor.
 21. The semiconductor deviceaccording to claims 13, wherein the first oxide semiconductor filmincludes c-axis aligned crystalline oxide semiconductor, and wherein thesecond oxide semiconductor film includes c-axis aligned crystallineoxide semiconductor.
 22. The semiconductor device according to claim 13,wherein the second insulating film is in contact with a side surface ofthe second conductive film, a side surface of the third conductive film,and a side surface of the first oxide semiconductor film, and whereinthe fourth insulating film is in contact with a side surface of thesixth conductive film, a side surface of the seventh conductive film,and a side surface of the second oxide semiconductor film.